Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world's largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.
Position: STAFF Product Development Engineer
Location: Valley Green, PA
We are seeking a highly experienced STAFF Product Development Engineer to lead the development of next-generation high-speed interconnect and connector solutions for AI infrastructure, hyperscale data centers, networking switches, and near-chip/co-packaged applications.
This is an individual-contributor role for an engineer who is already operating at a high level of technical independence. The ideal candidate has successfully taken complex electromechanical or interconnect products from early concept through design validation, customer qualification, manufacturing release, and production ramp. This person should be comfortable working with ambiguous customer requirements, advanced manufacturing technologies, tight mechanical/electrical constraints, and fast-moving cross-functional teams.
The work is highly collaborative, technically challenging, and directly tied to the future of AI and high-performance networking systems. Co-packaged copper/optics and near-package interconnect approaches are increasingly important in data-center networking as AI workloads drive higher bandwidth, lower power, and denser switch architectures.
What You Will Do
You will own product development activities for advanced high-speed connector and interconnect systems used in AI, hyperscale, and networking switch environments.
Key responsibilities include:
- Lead development of new high-speed connector, cable, socket, interposer, near-package, or co-packaged interconnect products from concept through production release.
- Translate customer needs, system-level requirements, and market direction into practical product architectures and manufacturable designs.
- Drive early concept generation, feasibility studies, mechanical architecture, material selection, tolerance strategy, and design tradeoff analysis.
- Work closely with signal integrity, mechanical engineering, process engineering, manufacturing, quality, test, suppliers, and customer-facing teams.
- Develop products that balance electrical performance, mechanical robustness, manufacturability, cost, reliability, thermal behavior, and scalability.
- Lead design reviews, risk assessments, DFM/DFA reviews, tolerance analyses, FMEA activities, and technical problem-solving sessions.
- Partner with global manufacturing and engineering teams to develop and mature advanced manufacturing processes.
- Support prototype builds, design validation, qualification testing, failure analysis, and production ramp.
- Interface with strategic customers, partners, and suppliers to resolve complex technical issues and align product direction.
- Mentor other engineers through technical review, design guidance, and product-development best practices without requiring close supervision yourself.
- Identify technical risks early and drive practical solutions before they impact customer commitments or manufacturing readiness.
What We Are Looking For
We are looking for someone who has already developed and launched complex hardware products in demanding, high-speed, high-volume, or high-reliability environments.
Required qualifications:
- Typically 12+ years of directly relevant product development experience, or equivalent depth of experience, in connectors, interconnects, electronic packaging, sockets, cable assemblies, high-speed electromechanical systems, or related hardware products.
- Demonstrated ownership of multiple products from concept through production release.
- Strong understanding of high-speed product-development constraints, including mechanical design, signal-integrity-driven tradeoffs, manufacturing process capability, materials, plating, tolerances, reliability, and qualification.
- Experience working on products for data center, networking, AI infrastructure, semiconductor packaging, optical/electrical interconnects, or other technically demanding electronics markets.
- Ability to operate independently in ambiguous situations and drive concepts toward manufacturable, validated product solutions.
- Strong mechanical aptitude and hands-on product-development instincts.
- Experience working with global engineering, manufacturing, supplier, and customer teams.
- Ability to communicate clearly with both technical and non-technical stakeholders.
- Strong problem-solving skills, including root-cause analysis, design iteration, and manufacturing issue resolution.
- Bachelor’s degree in Mechanical Engineering
Preferred Qualifications
- Experience with high-speed connectors, near-package interconnects, co-packaged optics, co-packaged copper, chip-adjacent interconnects, or advanced data-center interconnect architectures.
- Familiarity with AI accelerator, hyperscale, switch, router, or high-performance computing hardware environments.
- Experience with advanced manufacturing technologies such as precision stamping, molding, insert molding, micro-assembly, automated assembly, laser processing, plating, bonding, precision alignment, or high-volume connector manufacturing.
- Experience collaborating with signal integrity teams on high-speed electrical performance requirements.
- Familiarity with thermal, mechanical, and reliability challenges associated with dense interconnect systems.
- Experience with customer qualification processes, reliability testing, production ramp, and supplier development.
- Master’s degree or advanced technical training in a relevant engineering discipline.
What Success Looks Like
Within the first 6–12 months, this person should be able to:
- Take ownership of one or more advanced interconnect development programs with limited direction.
- Quickly understand customer requirements, technical risks, and manufacturing constraints.
- Generate credible product concepts and drive them through review, prototyping, and validation.
- Partner effectively with overseas/global teams and suppliers.
- Identify the highest-risk technical issues and create practical mitigation plans.
- Earn trust as a senior technical voice across engineering, manufacturing, quality, and customer-facing teams.
Work Environment
This is a fast-paced, collaborative, global engineering environment. You will work closely with cross-functional teams and partners across multiple regions. The problems are technically difficult, but the work is highly rewarding: you will help create advanced interconnect products that enable next-generation AI, hyperscale, and networking systems.
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